pb rohs eb13c5e2h-27.000m eb13c5 e 2 h -27.000m series rohs compliant (pb-free) low current 3.3v 4 pad 3.2mm x 5mm ceramic smd lvcmos oscillator frequency tolerance/stability 25ppm over 0c to +70c duty cycle 50 5% nominal frequency 27.000mhz logic control / additional output tri-state electrical specifications nominal frequency 27.000mhz frequency tolerance/stability 25ppm over 0c to +70c (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, ouput load change, first year aging at 25c, shock, and vibration) supply voltage 3.3vdc 10% input current 5ma maximum output voltage logic high (voh) 90% of vdd minimum input current logic high (ioh) -1.6ma output voltage logic low (vol) 10% of vdd maximum input current logic low (iol) +1.6ma rise/fall time 4nsec maximum (measured at 20% to 80% of waveform) duty cycle 50 5% (measured at 50% of waveform) load drive capability 15pf maximum output logic type cmos logic control / additional output tri-state tri-state input voltage (vih and vil) 90% of vdd minimum or no connect to enable output, 10% of vdd maximum to disable output (high impedance) standby current 10a maximum (disabled output: high impedance) one sigma clock period jitter 25psec maximum start up time 10 msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev a 8/12/2010 | page 1 of 5
eb13c5e2h-27.000m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state 2 ground 3 output 4 supply voltage line marking 1 e27.000 e=ecliptek designator 2 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year 1.14 1.0 1.2 (x4) 1.4 (x4) www.ecliptek.com | specification subject to change without notice | rev a 8/12/2010 | page 2 of 5 3.20 0.20 5.00 0.20 1.3 max 2.20 0.15 1.20 0.20 (x4) 1.00 0.20 (x4) 1.20 0.20 (x4) 2.54 0.15 1 2 3 4 marking orient a tion all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
eb13c5e2h-27.000m www.ecliptek.com | specification subject to change without notice | rev a 8/12/2010 | page 3 of 5 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% of w a v ef or m 50% of w a v ef or m 20% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eb13c5e2h-27.000m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev a 8/12/2010 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eb13c5e2h-27.000m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev a 8/12/2010 | page 5 of 5
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